Thumbnail for: Hand Soldering: Why It’s the Right Call For Your PCB Assembly

Hand Soldering: Why It’s the Right Call For Your PCB Assembly

Through-hole assembly, once the most common electronic assembly technique, has become rare in a world where tiny components with many connectors are the norm. Through-hole assembly is an excellent choice for producing a high-quality PCB assembly, but it cannot perform well when small size is the top priority. In some instances, particularly in unpredictable or extreme environments where high reliability is important, through-hole assembly is still the best way to go.

Thumbnail for: Guide to Understanding the PCBA Process

Guide to Understanding the PCBA Process

The world of electronics is constantly changing. It’s an industry with a rapid pace evolution and shows no signs of slowing down, but the printed circuit board assembly (PCBA) process is one standard among this swift progression.

Thumbnail for: Lead Free vs. Leaded Solder

Lead Free vs. Leaded Solder

Prior to 2006, most of the metallic components in electronic devices were created using tin or lead solder. These materials were reliable, easy to observe and understand and readily available. Assemblies were designed specifically for use with tin/lead solder, including the temperatures required to work with these materials.

Thumbnail for: Benefits of Surface Mount Technology

Benefits of Surface Mount Technology

 

If you have held a TV remote control in your hand, punched a button on a microwave or adjusted a digital thermostat, you have interacted with surface mount technology, or SMT. Since the 1980s, nearly all mass-produced electronics are now manufactured using SMT.

Thumbnail for: What is the difference between SMT and SMD?

What is the difference between SMT and SMD?

 

SMT and SMD.

These two little acronyms get mixed up a lot in the electronics manufacturing service world. On paper, they only vary by a single letter, but in practice, there’s a lot more separating SMTs and SMDs. Chiefly, one is a process and the other is a device.

Thumbnail for: Difference Between Through-Hole and Surface Mount Technology

Difference Between Through-Hole and Surface Mount Technology

Two assembly types are prevalent in electronics manufacturing: through-hole technology (THT) and surface mount technology (SMT). Selection of SMT or THT plays an important role in manufacturing efficiency and cost. This means it is important for customers to be aware of their definitions, differences, and applications.

Thumbnail for: What is IPC-A-610 J-STD-001 For Electronic Assembly?

What is IPC-A-610 J-STD-001 For Electronic Assembly?

J Standard, or it’s more official title IPC J-STD-001 is a standard that lists the requirements for the manufacture of electronic assemblies. This standard is published by the IPC as “Requirements for Soldered Electrical and Electronic Assemblies” and includes guidance on materials, manufacturing methods, and verification criteria.

Thumbnail for: Levison Enterprises Preserves the Lost Art of Through Hole

Levison Enterprises Preserves the Lost Art of Through Hole

Are you hitting a dead end trying to get your through hole board replaced or fixed?

Many electronic contract manufactures don’t do it anymore.

Though the benefits of surface mount assembly may have largely displaced through hole assembly, there are many applications where through hole assembly could remain the best choice.